Belonging to the series:
AMB-Si3N4
Using silicon nitride ceramic sheets, which have good thermal conductivity, high copper load capacity, excellent high-temperature and cold shock resistance, and a longer product lifespan.
Using silicon nitride ceramic sheets, which have good thermal conductivity, high copper load capacity, excellent high-temperature and cold shock resistance, and a longer product lifespan.
| Process Type | Unit | AMB | ||
| Standard and Ag-free | ||||
| Ceramic Type | - | Si3N4-01 | Si3N4-02 | Si3N4-03 |
| Ceramic Strength | Mpa | >700 | >700 | >700 |
| Thermal Conductivity of Ceramic | W/m.K | >130 | >80 | >60 |
| Breakdown Strength | KV/mm | >15 | >15 | >15 |
| Peel Strength | N/mm | >10 | >10 | >10 |
| Thermal Shock | Times | >3000 times | >3000 times | >3000 times |
| Surface Treatment | - | Bare Copper/Solder Mask/Nickel Plating/Nickel Gold Plating/Silver Plating | ||
| Ceramic Thickness Selection | mm | 0.25, 0.32 | ||
| Copper Thickness Selection | mm | 0.2, 0.25, 0.3, 0.4, 0.5, 0.8 | ||
Key words:
Direct Bonded Copper Substrate
Active Metal Brazed Copper Substrate
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