Belonging to the series:
AMB-AlN
Active Metal Brazed (AMB) substrates consist of a ceramic isolator, Si3N4 (silicon nitride), onto which pure copper is brazed in a high temperature vacuum brazing process.
Active Metal Brazed (AMB) substrates consist of a ceramic isolator, Si3N4 (silicon nitride), onto which pure copper is brazed in a high temperature vacuum brazing process.
| Process Type | Unit | AMB | |
| Standard and Ag-free | |||
| Ceramic Type | - | ALN-01 | ALN-02 |
| Ceramic Strength | Mpa | >550Mpa | >400Mpa |
| Thermal Conductivity of Ceramic Chip | W/m.K | >170 | >170 |
| Breakdown Strength | KV/mm | >20 | >20 |
| Peel Strength | N/mm | >10 | >10 |
| Thermal Shock | Times | >200 times | >200 times |
| Surface Treatment | - | Bare Copper/Solder Mask/Nickel Plating/Nickel Gold Plating/Silver Plating | |
| Ceramic Thickness Options | mm | 0.38, 0.635, 1.0 | |
| Copper Thickness Options | mm | 0.2, 0.25, 0.3, 0.4 | |
Key words:
Direct Bonded Copper Substrate
Active Metal Brazed Copper Substrate
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