Belonging to the series:
DBC-AlN
Using aluminum nitride ceramic sheets, which have good thermal conductivity and excellent mechanical properties, commonly used in high voltage and high frequency applications.
Using aluminum nitride ceramic sheets, which have good thermal conductivity and excellent mechanical properties, commonly used in high voltage and high frequency applications.
| Process Type | Unit | DBC | |
| Wet Method, Dry Method | |||
| Ceramic Type | - | ALN-01 | ALN-02 |
| Ceramic Strength | Mpa | >500Mpa | >350Mpa |
| Thermal Conductivity of Ceramic Pieces | W/m.K | >170 | >170 |
| Breakdown Strength | KV/mm | >20 | >20 |
| Peel Strength | N/mm | >4 | >4 |
| Thermal Shock | Times | >35 | >350Mpa |
| Surface Treatment | - | Bare Copper/Solder Mask/Nickel Plating/Nickel Gold Plating | |
| Ceramic Thickness Options | mm | 0.38, 0.635, 1.0 | |
| Copper Thickness Options | mm | 0.2, 0.25, 0.3, 0.4 | |
Key words:
Direct Bonded Copper Substrate
Active Metal Brazed Copper Substrate
Related Products
Product Consulting
Follow us
A new product catalog is required to understand the full product range of the same core.
©Ningbo Jiangfeng Tongxin Semiconductor Materials Co., Ltd.